Image sensing device, camera, and transportation equipment

ABSTRACT

An image sensing device is provided. The device comprises pixels including a first pixel which belongs to a first row and a first column, a second pixel which belongs to a second row and the first column and a third pixel which belongs to the second row and a second column, and readout units including a first readout circuit connected to the first and second pixels and a second readout circuit connected to the third pixel. The device performs a first operation and a second operation after the first operation. In the first operation, signal readout from the first and third pixels are performed. In the second operation, signal readout from the second pixel is performed. A controller determines, based on the signal generated by the first operation, a control parameter using to control the second operation.

BACKGROUND OF THE INVENTION Field of the Invention

The present invention relates to an image sensing device, a camera, anda transportation equipment.

Description of the Related Art

An image sensing device using a CMOS circuit is widely used in digitalcameras, digital camcorders, monitoring cameras, and the like. JapanesePatent Laid-Open No. 2002-320235 discloses a CMOS image sensor that has,in addition to a mode for reading out signals from all of the pixelsarranged in a pixel array, a mode for thinned-out reading of pixelsignals when reduced image signals are to be output. Japanese PatentLaid-Open No. 2005-86245 discloses a solid-state image sensing devicethat reduces the number of pixels which are read out for each frame toimprove the frame rate and alternately reads out, for each frame, animage sensing signal such as that for a moving image and animage-sensing target recognition signal such as that for autofocus.

SUMMARY OF THE INVENTION

Since Japanese Patent Laid-Open Nos. 2002-320235 and 2005-86245 eachhave an arrangement in which signal readout is performed for each rowwhen only signals from some of the pixels which are arranged in a pixelarray are to be read out, the readout operation time can be long if thepixels whose signals are to be read out are arranged over a plurality ofrows.

The present invention provides a technique advantageous in reducing thereadout time when signals are to be read out from some of the pixelswhich are arranged in a pixel array.

According to some embodiments, an image sensing device that comprises apixel array in which a plurality of pixels are arranged in a matrix anda plurality of readout circuits configured to read out signals from thepixel array, the plurality of pixels comprising a first pixel whichbelongs to a first pixel row of the pixel array and a first pixel columnof the pixel array, a second pixel which belongs to a second pixel rowof the pixel array and the first pixel column of the pixel array, and athird pixel which belongs to the second pixel row of the pixel array anda second pixel column of the pixel array, and the plurality of readoutunits comprising a first readout circuit connected to the first pixeland the second pixel and a second readout circuit connected to the thirdpixel, wherein the image sensing device performs a first image sensingoperation and performs a second image sensing operation after the firstimage sensing operation, wherein in the first image sensing operation,signal readout from the first pixel by the first readout circuit andsignal readout from the third pixel by the second readout circuit areperformed simultaneously, and wherein in second image sensing operation,signal readout from the second pixel by the first readout circuit isperformed, and wherein a controller determines, based on the signalgenerated by the first image sensing operation, a control parameterwhich is to be used to control the second image sensing operation, isprovided.

Further features of the present invention will become apparent from thefollowing description of exemplary embodiments (with reference to theattached drawings).

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a view showing an example of the arrangement of an imagesensing device according to an embodiment of the present invention;

FIGS. 2A to 2C are views each showing an example of the arrangement of apixel array of the image sensing device of FIG. 1;

FIG. 3 is a timing chart of a full pixel readout operation of the imagesensing device of FIG. 1;

FIG. 4 is a timing chart of a thinned-out reading operation of the imagesensing device of FIG. 1;

FIGS. 5A and 5B are a view showing an example of the arrangement of thepixel array and a timing chart of the thinned-out reading operation,respectively, of the image sensing device of FIG. 1;

FIG. 6 is a timing chart of an operation of the image sensing device ofFIG. 1;

FIG. 7 is a view showing an example of the arrangement of a pixel arrayof the image sensing device of FIG. 1;

FIG. 8 is a timing chart of an operation of the image sensing devicewhich includes the pixel array of FIG. 7;

FIGS. 9A to 9D are views showing examples of the arrangement of a cameraincorporating the image sensing device; and

FIGS. 10A and 10B are views showing examples of a transportationequipment mounted with the image sensing device of FIG. 1.

DESCRIPTION OF THE EMBODIMENTS

A detailed embodiment of an image sensing device according to thepresent invention will now be described with reference to theaccompanying drawings. Note that in the following description anddrawings, common reference numerals denote common components throughouta plurality of drawings. Hence, the common components will be describedby cross-reference to the plurality of drawings, and a description ofcomponents denoted by common reference numerals will be appropriatelyomitted.

An arrangement and an operation of the image sensing device according tothe embodiment of the present invention will be described with referenceto FIGS. 1 to 10B. FIG. 1 is a view showing an arrangement of an imagesensing device 100 according to an embodiment of the present invention.The image sensing device 100 includes a pixel array 101, a verticalscanning circuit 102, readout circuits 103, a horizontal scanningcircuit 104, a controller 105, and a control parameter line 106.

A plurality of pixels, on which photoelectric conversion elements arearranged, are arranged in a matrix in the pixel array 101. Here, in FIG.1, a lateral direction is called a row direction (horizontal direction),and a longitudinal direction is called a column direction. In thearrangement shown in FIG. 1, 16 rows, of which the uppermost end is the0th row and the lowermost end is the 15th row, and 16 columns, of whichthe rightmost end is the 0th column and the leftmost end is the 15thcolumn, of pixels are arranged in the pixel array 101. The verticalscanning circuit 102 selects pixels arranged in the row direction. Thereadout circuit 103 is arranged for each column and reads out a signal,via a column signal line of each row, from each pixel in a row that hasbeen selected by the vertical scanning circuit 102. The controller 105processes the signals from the readout circuits 103 which are scanned bythe horizontal scanning circuit 104 and feeds back the generated controlparameters to the vertical scanning circuit 102 and the readout circuits103 by using the control parameter line 106. The controller 105 maycontrol the components of the image sensing device 100, such as thevertical scanning circuit 102, the readout circuits 103, and thehorizontal scanning circuit 104. Note that a pixel color can beassociated with each pixel of the pixel array 101 by using a colorfilter array. A color filter array can, for example, employ a Bayerarray in which green pixels are assigned to a diagonal pixel pair of 2×2pixels and a red pixel and a blue pixel are assigned to the remainingtwo pixels.

Pixels arranged in the pixel array 101 includes a plurality offirst-type pixels 110 which are used in the thinned-out readingoperation (to be described later) and a plurality of second-type pixels120 which are not used in the thinned-out reading operation but are usedfor image generation. The first-type pixels 110 can be referred to asthinned-out reading pixels and the second-type pixels 120 can bereferred to as non-thinned-out reading pixels or normal readout pixels.Note that when reading out the second-type pixels 120, the first-typepixels 110 can also be read out without executing a thinning operationin the same manner as the second-type pixels 120. Although thefirst-type pixels 110 and the second-type pixels 120 can bedistinguished from each other in the point that their respective readoutmethods are different, they may have the same pixel structure. Here, arow in which the first-type pixel 110 and the second-type pixel 120 arearranged in the row direction will be called a first-type pixel row. Inother words, the pixel array 101 includes a plurality of first-typepixel rows each including at least one first-type pixel of the pluralityof first-type pixels 110 and one of the plurality of second-type pixels120. The pixel array 101 also includes a plurality of second-type pixelrows in which only the second-type pixels 120, other than the first-typepixels, are arranged in the row direction. In each first-type pixel row,at least one second-type pixel 120 is arranged between adjacentfirst-type pixels 110. Also, at least one row of pixels other than thefirst-type pixels, more specifically, a pixel row formed by only thesecond-type pixels 120 is arranged between adjacent first-type pixelrows. In the arrangement shown in FIG. 1, the first-type pixel 110 isarranged for every 4 pixels (4 rows) in the column direction and forevery 4 pixels (4 columns) in the row direction. Furthermore, in eachfirst-type pixel row, there are a plurality of types of positions wherethe first-type pixels 110 are to be arranged in the row direction. Forexample, among the plurality of first-type pixel rows, note the 1st rowof the first-type pixel rows (to be referred to as the 1st rowhereinafter) in the pixel array 101 and the 5th row of the first-typepixel rows (to be referred to as the 2nd row hereinafter) which isadjacent to the 1st row of the first-type pixel rows in the pixel array101. The columns where the first-type pixels 110, of the plurality offirst-type pixels 110, which are arranged in the 1st row are positionedare different from the columns where the first-type pixels 110, of theplurality of first-type pixels 110, which are arranged in the 2nd roware positioned. In this manner, the first-type pixels 110 may bearranged in different columns in adjacent first-type pixel rows. In thearrangement shown in FIG. 1, the first-type pixels 110 are arranged soas to be positioned at different columns from each other in the pixelarray 101 in which pixels are arranged in 16 rows×16 columns.

FIG. 2A shows the connection relation of the plurality of readoutcircuits 103 arranged for the respective columns in correspondence withthe first-type pixels 110, second-type pixels 120, the vertical scanningcircuit 102, and the pixel array 101. FIG. 2A shows the 1st, 2nd, and5th rows and 0th to 3rd columns of the pixel array 101. The first-typepixels 110 and the second-type pixels 120 each include a photoelectricconversion element PD, a floating diffusion region FD, and transistorsM1 to M4. The transistor M1 is a transfer transistor that transfers, tothe floating diffusion region FD, charges converted from light andaccumulated by the photoelectric conversion element PD. The transistorM2 is a reset transistor for resetting the photoelectric conversionelement PD and the floating diffusion region FD. The transistor M3 is asource-follower transistor that converts the charges transferred to thefloating diffusion region FD into a voltage signal and outputs theconverted signal. The transistor M4 is a selection transistor foroutputting a signal generated from light incident on each pixel to acorresponding column signal line 107 arranged along the columndirection.

A signal line group 130 for controlling the first-type pixels 110 and asignal line group 140 for controlling the second-type pixels 120 arearranged in the first-type pixel rows (the 1st row and the 5th row) fromthe vertical scanning circuit 102. A signal line group 141 forcontrolling the second-type pixels 120 is arranged in each pixel row(the 2nd row) in which only the second-type pixels 120 are arranged.Each of the signal line groups 130, 140, and 141 includes a signal linePTX (transfer control signal line) for controlling the transistor M1, asignal line PRES (reset control signal line) for controlling thetransistor M2, and a signal line PSEL (row selection signal line) forcontrolling the transistor M4. Each of the signal lines PTX, PRES, andPSEL can extend in the row direction crossing the column direction inwhich each column signal line extends. In FIG. 2A, “1” is added to thereference symbol of each of the signal lines PTX, PRES, and PSEL that isconnected to the first-type pixels 110, and “2” is added to thereference symbol of each of the signal lines PTX, PRES, and PSEL that isconnected to the second-type pixels 120. The number in bracketsfollowing the reference symbol of each of the signal lines PTX, PRES,and PSEL indicates the row number.

In the arrangement shown in FIG. 2A, a total of three signal lines arearranged as the signal line group 141 in the 2nd pixel row in which thefirst-type pixels 110 are not arranged and only the second-type pixels120 are arranged. However, the present invention is not limited to thisarrangement. For example, to ensure the opening of the photoelectricconversion element PD and a uniform parasitic capacitance of thefloating diffusion region FD, wiring lines may be added so that it willhave six signal lines which is the same number of lines as that of eachfirst-type pixel row. In other words, the total number of signal linesof the signal line group 130 and the signal line group 140 may be thesame as the number of signal lines of the signal line group 141. Thewiring lines to be added to the signal line group 141 may be, as shownin FIG. 2B, dummy signal lines PTXD, PRESD, and PSELD which are notconnected to any of the second-type pixels 120. The signal lines whichare to be added to the signal line group 141 may be a second signal linegroup which is connected to some of the second-type pixels 120 of thesame number as the first-type pixels 110 arranged in the first-typepixel row in the plurality of second-type pixels 120 as shown in FIG.2C. By adding a second signal group, the output wiring line load fromthe vertical scanning circuit 102 can be made equal in the first-typepixel rows and pixel rows other than the second-type pixel rows. In thiscase, for example, as shown in FIG. 2C, the second-type pixel 120 at the2nd column of each of the 0th, 2nd, and 3rd pixel rows may be connectedto signal lines PTX2B, PRES2B, and PSEL2B of the signal line group 141.That is, the connection relation between the signal line group 141 andthe second-type pixel 120 of in the second column of each of the 0th,2nd, and 3rd pixel rows may be the same as the connection relationbetween the signal line groups 130 and 140 and the first-type pixels 110and the second-type pixels 120 of the 1st first-type pixel row. In thesame manner, the connection relation between the 5th row and the 4th,6th, and 7th rows, the connection relation between the 9th row and the8th, 10th, and 11th rows, and the connection relation between the 13throw and the 12th, 14th, and 15th rows may be the same.

The operation of the image sensing device 100 will be described next.FIG. 3 is a timing chart of a readout operation performed to read outsignals from all of the pixels arranged in the pixel array 101. FIG. 3shows the timings at which signals are read out from pixels belonging tothe 0th row to the 5th row of the pixel array 101.

At time t1, the transistor M2 resets the floating diffusion region FD bysupplying a Hi signal to a signal line PSEL2 [0] and a signal line PRES2[0]. When the transistor M4 executes an ON operation (changes to aconductive state) simultaneously with the resetting of the floatingdiffusion region FD, the 0th row changes to the selected state, and areset level is output from the transistor M3 via the transistor M4 tothe corresponding column signal line 107. Subsequently, when a signalline PRES [0] changes to a Lo signal, the reset level of the 0th row isread out by the readout circuit 103 of each column.

Next, at time t2, accumulated charges are transferred from eachphotoelectric conversion element PD to the corresponding floatingdiffusion region FD when a Hi signal is supplied to a signal line PTX2[0]. When the signal line PTX2 [0] changes to a Lo signal, the signallevel of the 0th row is read out by the readout circuits 103. Correlateddouble sampling processing can be performed on the readout reset leveland signal level in each readout circuit 103 or in the controller 105.

At time t3, the 0th row is set to an unselected state when thetransistor M4 is changed to an OFF operation (a release state) by thesignal line PSEL2 [0] changing to a Lo signal. The time from time t1 totime t3 is the readout time of one row. At time t3, the readoutoperation of all of the pixels in the 1st row is started when a Hisignal is supplied simultaneously to each of signal lines PRES1 [1],PRES2 [1], PSEL1 [1], and PSEL2 [1], and the readout operation ends attime t4. Subsequently, each row is sequentially scanned in the samemanner, and signals are read out from the pixels belonging to the row.

A thinned-out reading operation of reading out signals from only thefirst-type pixels 110 among the pixels arranged in the pixel array 101will be described next. FIG. 4 is a timing chart of the thinned-outreading operation.

At time t11, a Hi signal is supplied to only signal lines PSEL1 andPRES1 of the 1st, 5th, 9th, and 13th rows which are the first-type pixelrows, and the first-type pixels 110 of each of the first-type pixel rowsare reset. Subsequently, each signal line PRES1 changes to a Lo signal,and the reset level is read out. Next, at time t12, a Hi signal issupplied to only a signal line PTX1 of each first-type pixel row, thesignal level of each first-type pixel row is read out when the signalline PTX1 changes to a Lo signal. Next, at time t13, the signal linePSEL1 of each first-type pixel row changes to a Lo signal and thereadout of each first-type pixel row ends.

In this embodiment, as shown in FIG. 1, the first-type pixels 110 of the1st, 5th, 9th, and 13th rows are arranged in different columns from eachother. Hence, signals from the first-type pixels 110 arranged in themanner described in FIG. 4 can be simultaneously read out by the readoutcircuits 103 arranged in corresponding columns within the readout timeof one row from time t11 to time t13. In this manner, when signals areto be read out from some of the pixels arranged in the pixel array 101,the speed of the thinned-out reading operation can be increased bysimultaneously reading out the signals from the first-type pixels 110arranged in different columns.

In the readout operation in which the readout circuits 103 read outsignals from the plurality of first-type pixels 110, the controller 105causes the first-type pixels 110 which are arranged in different columnsof the plurality of first-type pixels 110, to connect to correspondingdifferent column signal lines 107 among the plurality of column signallines 107. As a result, in the image sensing device 100, signals from atleast two or more first-type pixels 110 arranged in two first-type pixelrows among the plurality of first-type pixel rows can be read outsimultaneously by the readout circuits 103 arranged in correspondingcolumns. More specifically, in the arrangement shown in FIG. 2A, forexample, the plurality of pixels include a first-type pixel 110 a whichis arranged in the 1st pixel row and the 2nd pixel column of the pixelarray and a first-type pixel 110 b which is arranged in the 5th pixelrow and the 1st pixel column of the pixel array. The plurality of pixelsalso include a second-type pixel 120 a arranged in the 5th pixel row andthe 2nd pixel column of the pixel array. The plurality of readoutcircuits 103 include a readout circuit 103 a which is connected to thefirst-type pixel 110 a and the second-type pixel 120 a and a readoutcircuit 103 b which is connected to the first-type pixel 110 b. Thisarrangement allows the readout circuit 103 a to read out a signal fromthe first-type pixel 110 a and the readout circuit 103 b to read out asignal from the first-type pixel 110 b simultaneously. A signal is notread out from the second-type pixel 120 a which is connected to a columnsignal line 107 a as in the first-type pixel 110 a, and a signal is readout from the second-type pixel 120 a at a separate timing. In the samemanner, a signal is not read out from another second-type pixel 120which is connected to a column signal line 107 b as in the first-typepixel 110 b, and a signal is read out from the second-type pixel 120 atanother timing. That is, when signals are to be read out simultaneouslyfrom the first-type pixels 110 a and 110 b, signals are not read outfrom pixel rows which are arranged between the first-type pixel rows(the 1st pixel row and the 5th pixel row in the arrangement of FIG. 2A)in which the first-type pixels 110 a and 110 b are arrangedrespectively.

The timing chart of FIG. 4 described an example using the pixel array101 that includes 16 rows×16 columns of pixels. However, the arrangementof the pixel array 101 is not limited to this. For example, FIG. 5B is atiming chart of the thinned-out reading operation performed in the pixelarray 101 that includes 64 rows×64 columns of pixels in which thefirst-type pixels 110 are arranged at the same regularity as in FIG. 1as shown in FIG. 5A. In this case, of the first-type pixels 110 whichare present in the 64 rows and are to be arranged in the first-typepixel rows, the first-type pixels 110 of the 1st, 5th, 9th, and 13throws are read out in the readout time of one row. Subsequently, thereadout of 17th, 21st, 25th, and 29th rows, the readout of 33rd, 37th,41st, and 45th rows, and the readout of 49th, 53rd, 57th, and 61st rowscan be performed so that signals from all of the first-type pixels 110can be read out in the readout time of four rows from time t21 to timet22.

In this manner, in each of the plurality of first-type pixel rows, eachof the plurality of first-type pixels 110 is arranged for every M pixels(M columns), and the plurality of first-type pixel rows are arranged forevery N pixels (N rows) in the pixel array 101. In the readout operationof reading out signals from the first-type pixels 110, signals are readout simultaneously from the first-type pixels 110 belonging tocontinuous L first-type pixel rows of the plurality of first-type pixelrows. This can increase the speed of the thinned-out reading operation.In this case, L, M, and N each are a positive integer not less than 2and may be a positive integer not less than 3. If M and N each are notless than 3, a sufficient range of pixels can be subjected to readout athigh speed by executing thinned-out reading. L, M, and N may bedifferent from each other, two of the integers may be different fromeach other, two of integers may be the same, or all may be the same. Toreduce the distortion of an image that is obtained by thinned-outreading, M and N may be equal (M=N). In this example, L, M, and N allhave the same integer of 4. In this manner, the relation between L, M,and N may at least satisfy one of the relations of at least one of L, M,and N being not less than 3 and at least two of L, M, and N being equalto each other. Also, in consideration of the balance between the readoutspeed and the image quality, it may be set so that L is not less than ½of M, L may be not more than double of M (M/2≤L≤2×M), L is not less than½ of N, and L may be not more than double of N (N/2≤L≤2×N).

This embodiment has described how, in a case in which signals are to beread out from only some of the pixels arranged in the pixel array 101,the speed of the thinned-out reading operation can be increased byarranging the first-type pixels 110 at suitable positions. Next, theembodiment will describe a processing operation in which the suitableimage sensing condition by determining, based on the information of animage sensing operation by the first-type pixels 110 whose readingoperation speed has been increased, a control parameter for the signalsof the second-type pixels 120 of the next readout operation and trackinga high-speed moving object.

FIG. 6 is a timing chart of a case in which an image sensing operationby using the second-type pixels 120 is performed by using a controlparameter based on signals obtained from performing an image sensingoperation by using the first-type pixels 110 which perform thethinned-out reading operation. The arrangement of the image sensingdevice 100 is the same as those shown in FIGS. 1 and 2A.

A shutter operation 1000 (broken line) is a shutter operation ofperforming an image sensing operation by the first-type pixels 110. Thelongitudinal direction of the broken line indicating the shutteroperation 1000 represents the column direction (or the pixel rowposition at which the shutter operation is to be performed). The shutteroperation 1000 indicates that the vertical scanning circuit 102 performsscanning from the upper end to the lower end or from the lower end tothe upper end of the pixel array 101, and that an exposure operation ofthe first-type pixels 110 of each first-type pixel row is to be started.More specifically, in the shutter operation 1000, the exposure operationis started after a Hi signal is supplied to the signal lines PTX1 andPRES1 of each selected first-type pixel row, the photoelectricconversion element PD of each first-type pixel 110 is reset, and thesignal line PTX1 subsequently changes to a Lo signal.

A readout operation 1100 (solid line) is an operation of reading outsignals from the first-type pixels 110. The signals of the first-typepixels 110 of the 1st row selected by the vertical scanning circuit 102are read out simultaneously. At this time, the thinned-out readingoperation of reading out signals from the first-type pixels 110 isperformed at the same timings as those described above in FIGS. 4 and5B. The period between the shutter operation 1000 and the readoutoperation 1100 is the maximum width of a period (to be referred to as afirst image-sensing period hereinafter) of image-sensing by thefirst-type pixels 110, and the interval between the shutter operation1000 and the readout operation 1100 may be shortened as necessary.

In a signal processing operation 1110, each control parameter to be usedin the subsequent image sensing operation by the second-type pixels 120(to be described later) is determined by the controller 105 based on thesignals of the first-type pixels 110 that have undergone readout by thereadout circuits 103. The control parameter includes, for example, anexposure time of accumulating charges in the image sensing operation bythe second-type pixels 120, the gain of each readout circuit 103, aconversion resolution to be used when performing AD conversion, a region(ROI: Region of Interest) where the signal readout is to be performed inthe pixel array 101, or the like. The control parameter may also be usedfor the shutter speed setting, the ISO sensitivity setting, the f-numbersetting, the focusing of the lens, the signal processing level (forexample, the intensity of the noise removal), and the like which are tobe made in the camera for the image sensing operation by the second-typepixels 120. A shutter operation 1200 (broken line) is the shutteroperation of the second-type pixels 120. A readout operation 1300 is thereadout operation of reading out signals from the second-type pixels120. The period between the shutter operation 1200 and the readoutoperation 1300 is the maximum width of a period (to be referred to as asecond image-sensing period hereinafter) of image-sensing by thesecond-type pixels 120.

The operation of the image sensing device 100 will be described next.First, the controller 105 performs control so that an image sensingoperation is performed by the first-type pixels 110 in the firstimage-sensing operation. At time t101, scanning for the shutteroperation 1000 is started from the first-type pixel row on the upper endof the pixel array 101, and the shutter operation 1000 is completed attime t102. Next, at time t103, the readout operation 1100 is started.The controller 105 causes the readout circuits 103, arranged incorresponding columns, to read out signals generated by the first-typepixels 110 by the image sensing operation, sequentially from thefirst-type pixel row on the upper-end side of the pixel array 101. Thecontroller 105 starts the signal processing operation 1110 by usingthese signals. In the signal processing operation 1110, based on thesignals generated by the first-type pixels 110 of an arbitrary regionwhich have already undergone readout as the control parameters, thecontroller 105 determines the length of the exposure time of chargeaccumulation in the second image-sensing operation by the second-typepixels 120 in each row. Although the exposure time is determined foreach row in this case, the exposure time may be determined for eachplurality of rows. If the image sensing device 100 also includes anexposure control mechanism for each arbitrary number of pixels in therow direction, the length of the exposure time for each arbitrary columnmay also be determined in addition to the exposure time for each row.The control parameter may not only be the exposure time of thesecond-type pixels 120 but also the gain of each readout circuit 103 orthe conversion resolution of AD conversion in the readout operation 1300of reading out signals from the image sensing operation by thesecond-type pixels 120 or the readout region where the signals are to beread out in the pixel array 101. For example, since the exposure timeand the gain can be suitably set for each arbitrary row or for eachregion, the dynamic range of the image sensing device 100 can beincreased. In this manner, the controller 105 can determine the controlparameter for at least one of not less than one row in the pixel array101 and not less than one column in the pixel array 101.

The control parameters determined by the controller 105 are fed back tothe vertical scanning circuit 102 and the readout circuits 103 via thecontrol parameter line 106. At time t104, after the signals of thefirst-type pixels 110 of every first-type pixel row have been read out,the shutter operation 1000 of the first image-sensing operation of thesecond frame can be started. The thinned-out reading operation ofreading out signals from the first-type pixels 110 at time t103 to timet104 is performed at the same timing as described above in FIGS. 4 and5B.

Next, in the second image-sensing operation performed after the firstimage-sensing operation, the controller 105 performs control so that animage sensing operation will be performed by the second-type pixels 120in accordance with each determined control parameter. More specifically,when each control parameter has been determined by the controller 105,the shutter operation 1200 of the second image-sensing operation isstarted at time t105 after every shutter operation 1000 of the firstimage-sensing operation has been completed. Since the shutter operation1200 of each row is performed based on the exposure time determined foreach row by the signal processing operation 1110, for example, theshutter operation for an nth row is performed at time t106 and theexposure of the nth row is started. The exposure of each subsequent rowis started in the same manner. In the period from time t108 to timet109, the readout operation 1100 of the second frame in the firstimage-sensing operation is performed. When the signals generated fromall of the first-type pixels 110 have been read out, the readoutoperation 1300 of the first frame of the second image-sensing operationis started, and the readout of the signals generated in all of thesecond-type pixels 120 is completed at time t111.

As the second-type pixels 120 are arranged in all of the rows of thepixel array 101 and are present in the same column for adjacent rows inmost of the rows, the second-type pixels 120 need to be scanned andsubjected to readout for each row. Hence, the scanning time in thereadout operation 1100 of reading out signals from the first-type pixels110 can be shorter than the scanning time of the readout operation 1300of reading out signals from the second-type pixels 120. Although adetailed timing chart of the readout operation 1300 will not beillustrated, it is the same as that when the entire signal line group130 is changed to a Lo signal in FIG. 3. The subsequent operation is thesame as that of the previous frame, and thus a description will beomitted.

The above-described embodiment showed a case in which the exposure timeof accumulating charges in the second image-sensing operation iscontrolled as a control parameter. However, the controller 105 maycontrol, as a control parameter, the gain of each readout circuit 103,the conversion resolution of AD conversion in the readout operation 1300of reading out signals from the image sensing operation by thesecond-type pixels 120, or the readout region where the signals are tobe read out in the pixel array 101. In this case, the exposure time ofthe second-type pixels 120 need not be controlled as a control parameteror a plurality of parameters including the exposure time may be combinedand controlled. The control parameter may be used to control theexternal operation of the image sensing device. For example, the controlparameter can be used for the for the shutter speed setting, the ISOsensitivity setting, the f-number setting, the focusing of the lens, thesignal processing level (for example intensity of the noise removal),and the like which are to be made in the camera for the image sensingoperation by the second-type pixels 120. Here, consider a case in whichthe exposure time of accumulating charges in the second image-sensingoperation is not used as the control parameter in each of the imagesensing operations in which the image sensing device 100 repeats onefirst image-sensing operation and one second image-sensing operation. Inother words, consider a case in which the control parameter is the gainof each readout circuit 103, the conversion resolution of each readoutcircuit 103, or the readout region where the signals are to be read outin the pixel array 101. In this case, the controller 105 may perform thesecond image-sensing operation by using a first control parameterdetermined by the first image-sensing operation in the sameimage-sensing operation period. For example, the controller 105 may feedback, to the readout operation 1300 of the immediately following secondimage-sensing operation (time t109 to time t110), the control parameterdetermined based on the signals of the first-type pixels 110 obtained inthe readout operation 1100 of the first image-sensing operationperformed at time t108 to time t109.

As described above, based on the information of the first-type pixels110 in which the speed of the readout operation 1100 has been increased,the control parameter for the signals of the second-type pixels 120 tobe read out next is determined. As a result, it is possible to determinea suitable image-sensing condition by tracking a high-speed movingobject.

A processing operation of cutting out a suitable region corresponding toa higher speed moving object by making a determination to reduce thenext signal readout region in a stepwise manner based on the informationof the first-type pixels 110 obtained in the high-speed firstimage-sensing operation (thinned-out reading operation) will bedescribed next. Here, an example in which the above-described first-typepixels 110 operated by dividing the first-type pixels into two pixelgroups of first preliminary image sensing pixels 111 and secondpreliminary image sensing pixels 112 will be described.

FIG. 7 is a view showing the arrangement of the pixels of a pixel array101′ according to this embodiment. The pixel array 101′ includes 64rows×64 columns of pixels. In this embodiment, a first preliminary imagesensing operation and a second preliminary image sensing operationperformed after the first preliminary image sensing operation areperformed as the first image-sensing operation in which the thinned-outreading operation is performed. Hence, the first-type pixels 110 areclassified into the first preliminary image sensing pixels 111 to beused for the first preliminary image sensing operation of the first-typepixels 110 and the second preliminary image sensing pixels 112 differentfrom the first preliminary image sensing pixels 111 to be used for thesecond preliminary image sensing operation. In this embodiment, thefirst preliminary image sensing pixel 111 is arranged from the 5th rowof the pixel array 101′ at an interval of 8 rows. The second preliminaryimage sensing pixel 112 is arranged from the 1st row at an interval of 8rows. Components other than the pixel array 101′ may be the same asthose in the arrangement shown in FIG. 1, and thus a description ofcomponents other than the pixel array 101′ will be omitted.

FIG. 8 is a timing chart for explaining the operation of the imagesensing device 100 that includes the pixel array 101′. A shutteroperation 8000 is the shutter operation of the first preliminary imagesensing pixels 111. The readout operation 8100 is the readout operationof the first preliminary image sensing pixels 111. The period betweenthe shutter operation 8000 and the readout operation 8100 is the maximumwidth of a first preliminary image sensing period in the firstpreliminary image sensing pixels 111. A shutter operation 8200 is theshutter operation of the second preliminary image sensing pixels 112. Areadout operation 8300 is the readout operation of the secondpreliminary image sensing pixels 112. The period between the shutteroperation 8200 and the readout operation 8300 is the maximum width of asecond preliminary image sensing period in the second preliminary imagesensing pixels 112.

In a signal processing operation 8110, after the first preliminary imagesensing operation, a preliminary image sensing parameter of the secondpreliminary image sensing operation by the second preliminary imagesensing pixels 112 is determined by the controller 105 based on thesignals of the first preliminary image sensing pixel 111 read out by thereadout circuits 103. In a signal processing operation 8310, after thesecond preliminary image sensing operation, the control parameter of animage sensing operation by the second-type pixels 120 is determined bythe controller 105 based on the signals of the second preliminary imagesensing pixels 112 read out by the readout circuits 103. The preliminaryimage sensing parameter and the control parameter determined by thesignal processing operation 8110 and the signal processing operation8310, respectively, are the same as the control parameter described withreference to FIG. 6, and thus a description will be omitted.

The operation of the image sensing device 100 which includes the pixelarray 101′ will be described next. First, in the period of time t131 totime t132, the shutter operation 8000 of the first preliminary imagesensing operation is performed. Next, in the period of time t133 to timet134, the readout operation 8100 of the first preliminary image sensingpixel is performed. After the start of the readout operation 8100, thesignal processing operation 8110 of the first preliminary image sensingoperation is started. In the signal processing operation 8110, thecontroller 105 determines, based on the signals generated by the firstpreliminary image sensing pixels 111 of an arbitrary region that has atleast already undergone readout, a signal readout region 700 in thepixel array 101′ in the image sensing operation using the secondpreliminary image sensing pixels 112. For example, the region 700 thatincludes specific image-sensing target region may be determined from thesignals obtained in the first preliminary image sensing operation. Inthe arrangement shown in FIG. 7, the controller 105 selects, from thepixel array 101′ on which 64 rows×64 columns of pixels are arranged, theregion 700 on which 32 rows×32 columns of pixels are arranged. Thecontroller 105 feeds back, to the vertical scanning circuit 102 and thehorizontal scanning circuit 104, the signal readout region 700 of theimage sensing operation using the second preliminary image sensingpixels 112 determined via the control parameter line 106. At time t134,after all of the first preliminary image sensing pixels 111 haveundergone readout, the shutter operation 8000 of the second frame in thefirst preliminary image sensing operation can be started. Here, theregion (that is, the entire region of the pixel array 101) where thefirst preliminary image sensing pixels 111, which are the first-typepixels 110 whose signals are to be read out in the first preliminaryimage sensing operation, are to be arranged in the pixel array 101includes the region 700 where the second preliminary image sensingpixels 112 which are the first-type pixels 110 whose signals are to beread out in the second preliminary image sensing operation in the pixelarray 101 are arranged. Also, although this embodiment has set theregion 700 as a region where 32 rows×32 columns of pixels are arranged,the present invention is not limited to this, and the region may be setappropriately.

After the shutter operation 8200 of the second preliminary image sensingoperation has been performed in the period of time t135 to time t136,the readout operation 8100 of the second frame in the first preliminaryimage sensing operation is performed in the period of time t137 to timet138. After all of the readout operations 8100 have been completed, thereadout operation 8300 of the second preliminary image sensing operationis performed in the period of time t138 to time t139. After the start ofthe readout operation 8300, the signal processing operation 8310 of thesecond preliminary image sensing operation is started. In the signalprocessing operation 8310, the controller 105 determines, based on thesignals generated by the second preliminary image sensing pixels 112 ofan arbitrary region that has at least already undergone readout, asignal readout region 701 in the pixel array 101′ in the second imagesensing operation using the second-type pixels 120. For example, theregion 701 which includes a specific image sensing target may bedetermined from signals obtained in the second preliminary image sensingoperation. In the arrangement shown in FIG. 7, the controller 105selects, from the region 700 where 32 rows×32 columns of pixels arearranged, the region 701 where 16 rows×16 columns of pixels arearranged. The controller 105 feeds back, to the vertical scanningcircuit 102 and the horizontal scanning circuit 104, the region 701which has been determined via the control parameter line 106 and fromwhich signals are to be read out in the second image-sensing operationusing the second-type pixels 120. At time t139, after all of the secondpreliminary image sensing pixels 112 have undergone readout, the shutteroperation 8200 of the second frame can be started. Here the region 700,where the second preliminary image sensing pixels 112 which are thefirst-type pixels 110 whose signals are to be read in the secondpreliminary image sensing operation in the pixel array 101 are arranged,includes the region 701 where the second-type pixels 120 whose signalsare to be read in the second image-sensing operation in the pixel array101 are arranged. In this embodiment, the region 701 is a region inwhich 16 rows×16 columns of pixels are arranged. However, the presentinvention is not limited to this, and the region may be setappropriately.

After the shutter operation 8200 has been performed, the shutteroperation 1200 is performed in the period from time t140 to time t141,and the readout operation 1300 is performed in the period from time t142to time t143. At time t143, the readout of signals generated by thesecond-type pixels 120 arranged in the region 701 is completed.

In the operation of the image sensing device 100 shown in FIGS. 7 and 8,the controller 105 need not control, as the second preliminary imagesensing parameter and the control parameter, the exposure time in theimage sensing operation by the second preliminary image sensing pixels112 and the second-type pixels 120. If the exposure time is not to becontrolled, the controller 105 may feed back, to the immediatelyfollowing readout operation 8300, the preliminary image sensingparameter determined based on the signals of the first preliminary imagesensing pixels 111 obtained in the readout operation 8100. In the samemanner, the controller 105 may feed back, to the immediately followingreadout operation 1300, the preliminary image sensing parameterdetermined based on the signals of the first preliminary image sensingpixels 111 obtained in the readout operation 8300.

In the operation of the image sensing device 100 shown in FIGS. 7 and 8,the preliminary image sensing parameter and the control parameter neednot only be those of the signal readout regions (the regions 700 and701) in the pixel array 101. The preliminary image sensing parameter maybe the exposure time during which charge accumulation is performed inthe second preliminary image sensing operation by using the secondpreliminary image sensing pixels 112. The control parameter may be theexposure time during which the charge accumulation is performed in thesecond image-sensing operation by using the second-type pixels 120. Thepreliminary parameter and the control parameter may be the conversionresolution of the AD conversion or the gain of the readout circuits 103when the readout operations 8300 and 1300 of reading signals obtained inthe image sensing operation by the second preliminary image sensingpixels 112 and the second-type pixels 120. The regions 700 and 701 maybe selected by dividing the pixel array 101 into appropriate sizes inadvance or an arbitrary region may be selected from the pixel array 101based on the signals obtained in the first preliminary image sensingoperation and the second preliminary image sensing operation.

As described above, the next signal readout region is determinedstepwise based on the information of the thinned-out pixels whosereadout operation speed has been increased. As a result, it is possibleto perform a more suitable image sensing operation by tracking a higherspeed moving object.

As an application example of the image sensing device 100 according tothe above-described embodiment, a camera incorporating the image sensingdevice 100 will be exemplified hereinafter. Here, the concept of acamera includes not only a device whose main purpose is image capturingbut also a device (for example, a personal computer, mobile terminal,etc.) that auxiliarly has an image capturing function.

As shown in FIG. 9A, the image sensing device 100 may include, in onesemiconductor chip 910, the pixel array 101, a signal processor 902, anda control circuit 901 that includes the vertical scanning circuit 102,the readout circuits 103, the horizontal scanning circuit 104, andcontroller 105. The image sensing device 100 may be formed from aplurality of semiconductor chips. For example, the image sensing device100 includes a semiconductor chip 910 a and a semiconductor chip 910 bwhich are stacked in the manner shown in FIG. 9B. In this case, thecontrol circuit 901 and the pixel array 101 may be included in thesemiconductor chip 910 a, and the signal processor 902 may be includedin the semiconductor chip 910 b. The image sensing device 100 mayinclude the pixel array 101 in the semiconductor chip 910 a and thecontrol circuit 901 and the signal processor 902 in the semiconductorchip 910 b as shown in FIG. 9C. In a case in which the image sensingdevice 100 has a structure in which the semiconductor chip 910 a and thesemiconductor chip 910 b are stacked in the manner shown in FIGS. 9B and9C, the semiconductor chip 910 a and the semiconductor chip 910 b areelectrically connected to each other by direct connection of wiringlines, through-silicon vias, or bumps. The signal processor 902 caninclude an A/D conversion circuit and a processor (ISP: Image SignalProcessor) that processes digital data of the A/D-converted image data.

FIG. 9D is a schematic view of an equipment EQP incorporating the imagesensing device 100. An electronic equipment such as a camera, aninformation equipment such as a smartphone, a transportation equipmentsuch as an automobile or an airplane, or the like is an example of theequipment EQP. The image sensing device 100 can include, other than asemiconductor device IC which includes the semiconductor chip on whichthe pixel array 101 is arranged, a package PKG that contains thesemiconductor device IC. The package PKG can include a base on which thesemiconductor device IC is fixed and a lid member made of glass or thelike which faces the semiconductor device IC, and connection memberssuch as a bump and a bonding wire that connect a terminal arranged inthe base and a terminal arranged in the semiconductor device IC to eachother. The equipment EQP can further include at least one of an opticalsystem OPT, a control device CTRL, a processing device PRCS, a displaydevice DSPL, and a memory device MMRY. The optical system OPT formsimages in the image sensing device 100 and is formed from, for example,a lens, a shutter, and a mirror. The control device CTRL controls theoperation of the image sensing device 100 and is a semiconductor devicesuch as an ASIC. The processing device PRCS processes signals outputfrom the image sensing device 100 and is a semiconductor device such asa CPU or an ASIC for forming an AFE (Analog Front End) or a DFE (DigitalFront End). The display device DSPL is an EL display device or a liquidcrystal display device that displays information (image) acquired by theimage sensing device 100. The memory device MMRY is a magnetic device ora semiconductor device for storing information (image) acquired by theimage sensing device 100. The memory device MMRY is a volatile memorysuch as an SRAM, DRAM, or the like or a nonvolatile memory such as aflash memory, a hard disk drive, or the like. A mechanical device MCHNincludes a driving unit or propulsion unit such as a motor, an engine,or the like. The mechanical device MCHN in the camera can drive thecomponents of the optical system OPT for zooming, focusing, and shutteroperations. In the equipment EQP, signals output from the image sensingdevice 100 are displayed on the display device DSPL and are transmittedexternally by a communication device (not shown) included in theequipment EQP. Hence, it is preferable for the equipment EQP to furtherinclude the memory device MMRY and the processing device PRCS that areseparate from a storage circuit unit and calculation circuit unitincluded in the control circuit 901 and the signal processor 902 in theimage sensing device 100.

As described above, the image sensing device 100 according to thisembodiment can track a high speed moving object. Hence, a cameraincorporating the image sensing device 100 is applicable as a monitoringcamera, an onboard camera mounted in a transportation equipment such asan automobile or an airplane, or the like. A case in which the cameraincorporating the image sensing device 100 is applied to thetransportation equipment will be exemplified here. A transportationequipment 2100 is, for example, an automobile including an onboardcamera 2101 shown in FIGS. 10A and 10B. FIG. 10A schematically shows theouter appearance and the main internal structure of the transportationequipment 2100. The transportation equipment 2100 includes an imagesensing device 2102, an image sensing system ASIC (Application SpecificIntegrated Circuit) 2103, a warning device 2112, and a control device2113.

The above-described image sensing device 100 is used for the imagesensing device 2102. The warning device 2112 warns a driver when itreceives an abnormality signal from an image-sensing system, a vehiclesensor, a control unit, or the like. The control device 2113comprehensively controls the operations of the image sensing system, thevehicle sensor, the control unit, and the like. Note that thetransportation equipment 2100 need not include the control device 2113.In this case, the image sensing system, the vehicle sensor, and thecontrol unit each can individually include a communication interface andexchange control signals via a communication network (for example, CANstandard).

FIG. 10B is a block diagram showing the system arrangement of thetransportation equipment 2100. The transportation equipment 2100includes the first image sensing device 2102 and the second imagesensing device 2102. That is, the onboard camera according to thisembodiment is a stereo camera. An object image is formed by an opticalunit 2114 on each image sensing device 2102. An image signal output fromeach image sensing device 2102 is processed by an image pre-processor2115 and transmitted to the image sensing system ASIC 2103. The imagepre-processor 2115 performs processing such as S-N calculation andsynchronization signal addition. The above-described signal processor902 corresponds to at least a part of the image pre-processor 2115 andthe image sensing system ASIC 2103.

The image sensing system ASIC 2103 includes an image processor 2104, amemory 2105, an optical distance measuring unit 2106, a parallaxcalculator 2107, an object recognition unit 2108, an abnormalitydetection unit 2109, and an external interface (I/F) unit 2116. Theimage processor 2104 generates an image signal by processing signalsoutput from the pixels of each image sensing device 2102. The imageprocessor 2104 also performs correction of image signals andinterpolation of abnormal pixels. The memory 2105 temporarily holds theimage signal. The memory 2105 may also store the position of a knownabnormal pixel in the image sensing device 2102. The optical distancemeasuring unit 2106 uses the image signal to perform focusing ordistance measurement of an object. The parallax calculator 2107 performsobject collation (stereo matching) of a parallax image. The objectrecognition unit 2108 analyzes image signals to recognize objects suchas transportation equipment, a person, a road sign, a road, and thelike. The abnormality detection unit 2109 detects the fault or an erroroperation of the image sensing device 2102. When detecting a fault or anerror operation, the abnormality detection unit 2109 transmits a signalindicating the detection of an abnormality to the control device 2113.The external I/F unit 2116 mediates the exchange of information betweenthe units of the image sensing system ASIC 2103 and the control device2113 or the various kinds of control units.

The transportation equipment 2100 includes a vehicle informationacquisition unit 2110 and a driving support unit 2111. The vehicleinformation acquisition unit 2110 includes vehicle sensors such as aspeed/acceleration sensor, an angular velocity sensor, a steering anglesensor, a ranging radar, and a pressure sensor.

The driving support unit 2111 includes a collision determination unit.The collision determination unit determines whether there is apossibility of collision with an object based on the pieces ofinformation from the optical distance measuring unit 2106, the parallaxcalculator 2107, and the object recognition unit 2108. The opticaldistance measuring unit 2106 and the parallax calculator 2107 areexamples of distance information acquisition units that acquire distanceinformation of a target object. That is, distance information is piecesof information related to the parallax, the defocus amount, the distanceto the target object and the like. The collision determination unit mayuse one of these pieces of distance information to determine thepossibility of a collision. Each distance information acquisition unitmay be implemented by dedicated hardware or a software module.

An example in which the driving support unit 2111 controls thetransportation equipment 2100 so it does not collide against anotherobject has been described. However, it is also applicable to control ofautomatic driving following another vehicle or control of automaticdriving not to drive off a lane.

The transportation equipment 2100 also includes driving devices, whichare used for movement or supporting a movement, such as an air bag, anaccelerator, a brake, a steering, a transmission, an engine, a motor,wheels, propellers, and the like. The transportation equipment 2100 alsoincludes control units for these devices. Each control unit controls acorresponding driving device based on a control signal of the controldevice 2113.

The image sensing system used in the embodiment is applicable not onlyto an automobile and a railway vehicle but also to, for example,transportation equipment such as a ship, an airplane, or an industrialrobot. The image sensing system is also applicable not only to thetransportation equipment but also widely to equipment using objectrecognition such as an ITS (Intelligent Transportation System).

While the present invention has been described with reference toexemplary embodiments, it is to be understood that the invention is notlimited to the disclosed exemplary embodiments. The scope of thefollowing claims is to be accorded the broadest interpretation so as toencompass all such modifications and equivalent structures andfunctions.

This application claims the benefit of Japanese Patent Application No.2017-156884, filed Aug. 15, 2017 which is hereby incorporated byreference wherein in its entirety.

1-20. (canceled)
 21. An image sensing device that comprises a firstsemiconductor chip which includes a pixel array in which a plurality ofpixels are arranged in a matrix and a second semiconductor chip whichincludes a plurality of readout circuits configured to read out signalsfrom the pixel array, wherein the first semiconductor chip and thesecond semiconductor chip are stacked on each other, the plurality ofpixels includes a plurality of first-type pixels and a plurality ofsecond-type pixels, a number of the plurality of first-type pixels isless than a number of the plurality of the second-type pixels, the imagesensing device performs a first image sensing operation and performs asecond image sensing operation, in a first image sensing operation,first signal read out from the plurality of first-type pixels by theplurality of readout circuits is performed, in a second image sensingoperation, second signal read out from the plurality of second-typepixels by the plurality of readout circuits is performed, and a controlparameter for reading out the second signal from the plurality ofsecond-type pixels in the second image sensing is determined based onthe first signal read out from the plurality of first-type pixels in thefirst image sensing operation.
 22. The device according to claim 21,wherein the control parameter comprises at least one of an exposure timeof accumulating charges, a gain of the plurality of readout circuits,conversion resolution of the plurality of readout circuits, and a signalreadout region of the pixel array in the second image sensing operation.23. The device according to claim 21, wherein the control parametercomprises an exposure time of accumulating charges in the second imagesensing operation.
 24. The device according to claim 23, wherein atleast one of the plurality of first-type pixels is arranged in a firstpixel row, and the plurality of the first-type pixels is not arranged ina second pixel row adjacent to the first pixel row.
 25. The deviceaccording to claim 23, wherein at least one of the plurality offirst-type pixels is arranged in a first pixel column, and the pluralityof the first-type pixels is not arranged in a second pixel columnadjacent to the first pixel column.
 26. The device according to claim23, wherein the control parameter is determined by at least one of notless than one row of the pixel array and not less than one column of thepixel array.
 27. The device according to claim 23, wherein a signal isread out from the plurality of second-type pixels in a second imagesensing operation.
 28. The device according to claim 23, wherein in eachof pixel rows to which the plurality of the first-type pixels belong,each of the plurality of first-type pixels is arranged for every Mpixels (M is a positive integer not less than 2), in the pixel array,the pixel row to which the plurality of the first-type pixels belong isarranged for every N rows (N is an integer not less than 2), and signalreadout is performed simultaneously from first-type pixels belonging tocontinuous L pixel rows (L is an integer not less than 2) among pixelrows to which the plurality of the first-type pixels belong.
 29. Thedevice according to claim 28, further comprising in each of the pixelrows to which the plurality of the first-type pixels belong, a firstsignal line group configured to control the first-type pixels belongingto each of the pixel rows among the plurality of first-type pixels, anda second signal line group configured to control a pixel other than theplurality of first-type pixels.
 30. The device according to claim 29,further comprising a third signal line group configured to control apixel included in each of plurality of pixel rows which do not includethe plurality of first-type pixels, and a total signal line count of thefirst signal line group and the second signal line group and a linecount of the third signal line group are equal to each other.
 31. Thedevice according to claim 21, wherein an image sensing operation ofperforming one first image sensing operation and one second imagesensing operation is repeated, and in the image sensing operation, aftersignals generated by the first image sensing operation are read out bythe plurality of readout circuits, signals generated by the second imagesensing operation are read out by the plurality of readout circuits. 32.The device according to claim 31, further comprising a controllerconfigured to determine the control parameter, wherein the first imagesensing operation comprises a first preliminary image sensing operationand a second preliminary image sensing operation which is performedafter the first preliminary image sensing operation, the plurality offirst-type pixels comprise a first preliminary image sensing pixel whichis used in the first preliminary image sensing operation and a secondpreliminary image sensing pixel which is different from the firstpreliminary image sensing pixel and is used in the second preliminaryimage sensing operation, the controller determines, based on a signalgenerated by the first preliminary image sensing pixel in the firstpreliminary image sensing operation, a preliminary image sensingparameter to be used for accumulating charges in the second preliminaryimage sensing operation and controlling the second preliminary imagesensing operation, the controller causes the plurality of readoutcircuits to read out each signal generated by the second preliminaryimage sensing pixel in the second preliminary image sensing operation,and the controller determines the control parameter by using the signalgenerated by the second preliminary image sensing pixel.
 33. The deviceaccording to claim 32, wherein in the pixel array, a region in which thefirst preliminary image sensing pixel is arranged comprises a region inwhich the second preliminary image sensing pixel is arranged.
 34. Thedevice according to claim 33, wherein in the pixel array, a region inwhich the second preliminary image sensing pixel is arranged comprises aregion in which of the plurality of pixels, a pixel whose signal is tobe read out in the second image sensing operation is arranged.
 35. Thedevice according to claim 34, wherein the preliminary image sensingparameter comprises at least one of an exposure time of accumulatingcharges, a gain of the plurality of readout circuits, conversionresolution of the plurality of readout circuits, and a signal readoutregion of the pixel array in the second preliminary image sensingoperation.
 36. The device according to claim 21, wherein a scanning timeof the first image sensing operation is shorter than a scanning time ofthe second image sensing operation.
 37. A camera comprising: an imagesensing device defined in claim 21; and a control device configured tocontrol an operation of the image sensing device.
 38. A transportationequipment that includes a driving device, comprising: an image sensingdevice defined in claim 21; and a control device configured to controlthe driving device based on information acquired by the image sensingdevice.